Controlled component tinning for tin whisker risk mitigation
Same destination, faster and cleaner route
INCUMBENT
Robotic Hot Solder Dip
Governed by GEIA-STD-0006
Full Pb-free to SnPb conversion; eliminates tin whisker risk
Branded and fielded by incumbents
Scaling requires more robotic dip capacity, slower to surge
SSI PROCESS
Solder Paste Reflow
Meets the same recognition points as GEIA-STD-0006 and IEC TS62647-4
Same finish-conversion and tin-whisker outcome
Scales faster than robotic hot solder dip
Superior solderability and coplanarity results
SemiPack’s Solder Paste Reflow (SPR) process applies a tin-lead finish to electronic component terminations using precision solder paste printing, automated placement, and controlled reflow.
Package-specific thermal profiles and X-ray fluorescence (XRF) analysis support repeatable processing and verification of finish composition and thickness.
Precision throughout the process
Controlled solder deposition
Package-specific thermal profiles
Finish composition and thickness verification
Support for chip, leaded, and bottom-terminated packages
1. Print and inspect solder paste
Controlled stencil printing deposits solder paste for the component layout, followed by solder paste inspection.
2. Place components
Automated pick-and-place equipment uses vision alignment to position components on the paste.
3. Reflow under controlled conditions
Components pass through a nitrogen-equipped reflow oven using a thermal profile developed for the package. Ramp rates, time above liquidus, and peak temperature are monitored.
4. Verify the finish
XRF sampling checks finish composition and thickness, with statistical analysis supporting process evaluation.
Verified Finish Quality
Coating composition and thickness analysis
Statistical analysis reporting
Supported Component Packages
Ceramic chip, ferrite, and tantalum components
Package sizes shown include 0402, 0603, 0805, and 1206.
Plastic molded components
SOIC-8, SOIC-14, SOT-23, TSOT-6, QFN, DFN, QFP, PLCC, and TSOP.
Contact SemiPack to review compatibility with your specific part number and finish requirements.
QFN and DFN packages have bottom terminations intended for solder attachment. Their exposed sides, or flanks, may have a different finish.
Non-wettable flanks may expose unplated metal and may not accept solder reliably. Manufacturer-designed wettable flanks have a solderable finish intended to support sidewall wetting.
Expected coverage therefore depends on the component’s construction and original finish.
QFN & DFN Sidewall Solderability
Frequently Asked Questions
Is the final finish always 63% tin and 37% lead?
No. The original tin plating mixes with the applied solder during reflow, changing the final composition. SemiPack uses XRF analysis to evaluate the resulting finish.
Does SPR remove existing gold plating?
No. SPR does not remove the original plating and is not a process for gold embrittlement risk mitigation.
How is the process verified?
SemiPack uses standards-based XRF equipment to analyze finish thickness and composition. SEM, EDS, and elemental mapping have also been used to validate and qualify the SPR process.
Discuss Your SPR Tinning Requirements
Share your component part number, package type, quantity, existing finish, desired finish, and delivery requirements. SemiPack’s team can evaluate the application and recommend the appropriate process.
Explore our robotic tinning services or contact us to discuss your application.
